Fiber optic transmission lines on an soc

ABSTRACT

An optical transmission method. Signal transmissions between cores of an integrated circuit are performed. Each signal transmission is between two cores of a different pair of cores of the integrated circuit. Each signal transmission includes transmission of an optical signal in the visible or infrared portion of the electromagnetic spectrum at a wavelength that is specific to each different pair of cores and is a different wavelength for each different pair of cores. There is no overhead for decoding or arbitration in preforming the signal transmissions that would otherwise exist if a same wavelength for the optical signals were permitted for pairs of cores of the different pairs of cores.

This application is a divisional of Ser. No. 10/604,410, filed Jul. 18,2003.

FIELD OF INVENTION

This invention relates generally to using a fiber optic medium within aSOC (i.e., System On Chip) silicon dioxide layer of a chip to transmitlight thereby serving as a signal transmission means within the chip.

BACKGROUND OF INVENTION

In the field of integrated circuit construction, in general, and in theconstruction of large ASIC's (i.e., Application Specific IntegratedCircuit), in particular, the wiring distance between cores has becomegreater and greater as the space or paths to physically run the numerouswiring becomes more and more impinged upon due to overcrowding byadditional cores. A resultant disadvantage is that latency problemsoccur wherein a signal fails to be latched onto the receiving corewithin the current clock cycle.

Accordingly, there is a need in the field of ASIC's for an improved wayfor communicating that overcomes the aforementioned, and other,disadvantages.

SUMMARY OF INVENTION

The present invention provides an integrated circuit using an opticaltransmission network and a method for transmitting data using theoptical transmission network.

A first general aspect of the invention provides an integrated circuitcomprising:

a plurality of cores operatively attached to at least one transmitterand at least one receiver;

an optical transmission network embedded within at least one wire levelof the integrated circuit;

said at least one transmitter for sending data on said opticaltransmission network; and

said at least one receiver for receiving data on said opticaltransmission network.

A second general aspect of the invention provides a method oftransmitting signals within an integrated circuit comprising:

providing said integrated circuit, wherein said integrated circuitincludes a plurality of cores and a plurality of optical paths;

selecting an optical path from said plurality of optical paths fortransmission of data; and

transmitting data on said selected optical path.

A third general aspect of the present invention provides an integratedcircuit comprising:

an optical transmission network;

a plurality of cores operatively attached to said optical transmissionnetwork; and

a plurality of controllers operatively attached to said opticaltransmission network and said plurality of cores.

The foregoing and other features of the invention will be apparent fromthe following more particular description of various embodiments of theinvention.

BRIEF DESCRIPTION OF DRAWINGS

Some of the embodiments of this invention will be described in detail,with reference to the following figures, wherein like designationsdenote like members, wherein:

FIG. 1A depicts a top view of a fiber optic transmission layer, inaccordance with an embodiment of the present invention;

FIG. 1B depicts an alternative embodiment of the same view as FIG. 1A,in accordance with an embodiment of the present invention;

FIG. 1C depicts a third embodiment of the same view as FIG. 1A, inaccordance with an embodiment of the present invention;

FIG. 2A depicts a side sectional view of die showing multiple fibertransmission layers, in accordance with an embodiment of the presentinvention;

FIG. 2B depicts an alternative embodiment of the same view as FIG. 2A,in accordance with an embodiment of the present invention;

FIG. 3 depicts a schematic top view of a fiber transmission layer alongwith a plurality of transmitters and receivers connected thereto, inaccordance with an embodiment of the present invention;

FIG. 4 depicts a functional diagram of a portion of a fiber opticnetwork, in accordance with an embodiment of the present invention;

FIG. 5 depicts a flow chart of a communication method, in accordancewith an embodiment of the present invention;

FIGS. 6A, 6B, 6C depict top views of various bumps, in accordance withan embodiment of the present invention;

FIGS. 7A, 7B, 7C depict side views of the corresponding views depictedin FIGS. 6A, 6B, 6C, respectively, in accordance with an embodiment ofthe present invention;

FIG. 8 depicts a larger side sectional view of FIG. 7C, in accordancewith an embodiment of the present invention;

FIGS. 9A, 9B, and 9C depict various configurations of redirectionterminations, in accordance with an embodiment of the present invention;

FIG. 10 depicts a side sectional close up view of a portion of a dieemploying some of the redirection terminations, in accordance with anembodiment of the present invention; and

FIG. 11 depicts a side sectional closeup view of an edge of a die, inaccordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Although certain embodiments of the present invention will be shown anddescribed in detail, it should be understood that various changes andmodifications may be made without departing from the scope of theappended claims. The scope of the present invention will in no way belimited to the number of constituting components, the materials thereof,the shapes thereof, the relative arrangement thereof, etc., and aredisclosed simply as an example of an embodiment. Although the drawingsare intended to illustrate the present invention, the drawings are notnecessarily drawn to scale.

The present invention provides for an improved integrated chip design.

General:

Integrated Chips (i.e., IC), as currently configured have severaldisadvantages. Integrated chips are getting more and more dense and morecomplex. The number of active circuits in a given area of the chip isincreasing, as is the amount of connectivity of the integrated circuit.Studies have shown that as the number of vias connecting metal layersfurther increases, a point will be reached wherein the further adding ofadditional levels of metal connectivity layers will not, in turn,significantly increase the amount of connections because the new levelof vias will not have available any connection path to the lower metallevels due to the previously open, available areas now being blocked bywires or vias. Current silicon is reaching a constraint of physicaldistance and RC load limits, where an alternative cross chip means ofcommunication is desired. In sum, the IC, as currently configured, isheading to the point wherein eventually “there will be no room at theIC”.

The wiring in current IC's is a problem. Relatively speaking the wiringcreates slow communication across a die. The requirement of usingbuffers, which effectively is part of the “virtual” wiring results ineffective wiring delay.

A solution to this problem, as the present invention provides, is to usethe oxide, which is currently silicon dioxide or glass, between themetal layers, as a transmission means for transmitting (i.e., sendingand receiving) optical signals from one device to another. An opticaltransmission path would not necessarily be shaped, but instead usediffusion of light through the oxide medium to go from an opticaltransmitter to an optical receiver.

Thus, the present invention effectively is replacing the traditionalwiring and buffers in the IC with optical fibers and cores. Amongstother resultant improvements, the cycle time is improved across the die.Other improvements include: no heat generation in the circuitry, littlesignal loss, communication without electrical noise, and the capabilityof having “N” number of channels for transmission.

Currently, vias substantially limit wireability as the number of metallayers increases (and therefore the number of vias increase too). In thepresent invention, however, by using an oxide plane for the opticalsignals, the transmitted light can diffuse around the existing vias.This ability in the present invention creates the added benefit ofthereby allow for the further increase of the number of layers in an ICthat can be used for traditional wiring.

Ultimately, the present invention creates a faster ASIC (i.e.,Application Specific Integrated Circuit) that overcomes latencyproblems, a more powerful ASIC, and an ASIC with more functionalities.

Specifics:

Turning to the enclosed figures, FIGS. 1A, 1B, and 1C depict top viewsof various embodiments of possibly layouts of a layer, or plane, offiber optic channels, tunnels, or wires to be used within an ASIC. Afiber optic network 9 (See e.g., FIGS. 2, 10, 11), within an IC is madeup of one, or more, layers, planes, or grids, denoted by a 10. Singlefiber optic fibers 12 make up the grid 10. The fiber optic fibers 12 maybe made of any suitable optical transmission medium, either typicallynow found in IC's or as an added or improved upon feature. For example,the fiber optic fibers 12 may be made of silicon dioxide, glass, etc. AsFIGS. 1A, 1B, and 1C all indicate, the fibers 12 may be run in numerousconfigurations. For example, FIGS. 1A and 1B show how the fibers 12 ingrid 10 can be parallel or perpendicular to itself, or some combinationof the two. FIG. 1C shows that the density of the fibers 12 within 10can differ, as well, for in FIG. 1C the density of fibers 12 is muchhigher than in the embodiments in FIGS. 1A and 1B. It should be apparentto one skilled in the art, that there is virtually an infinite varietyof grids 10 conceivable wherein the location, density, direction of thefibers 12 can differ and vary.

While FIGS. 1A, 1B, and 1C show a single layer, or plane, 10 of fibers12, the fibers 12, in the present invention, can traverse acrossmultiple layers within the ASIC, following an essentially verticalconfiguration, as well. For example, FIGS. 2A and 2B, depict sidesectional views of portions of a die, or ASIC, 5. A fiber networkcomprises the plurality of fiber layers 10. As seen, the optical fibers12 can traverse the various layers of the die 5 in a plurality ofdirections and configurations. For example, FIG. 2A shows a plurality ofglass levels 10A, 10B, 10C, 10C made up of optical fibers 12. The glassfibers 12 run in a first direction in the top glass level 10A, asdepicted by directional arrow 11A. Conversely, the optical fibers 12 inthe bottom glass level 10C run in a second direction, as depicted bydirectional arrow 11B. Note that directional arrows 11A and 11B run indifferent directions. The angle between directional arrows 11A, 11B canbe 90 degrees, acute, or obtuse. FIG. 2B shows sectional side view of aportion of a die, in this embodiment wherein the glass fibers 12 run indifferent directions in successive layers, and in the same direction inlayers 10A, 10C, or in layers 10B, 10C. See, for example, directionalarrows 11C, 11D for glass fibers 12 in layers 10A and 10D.

Turning to FIG. 3 which depicts a schematic top view of a portion of adie 5, showing one layer 10 of fibers 12 with associated elements.Located within the fiber layer, or plane 10 are a plurality of drivers20, or optical transmitters, and optical receivers 30. The opticaltransmitters 20 and optical receivers 30 are coupled to the fiber layer10 which is, in turn, connected to the other fiber layers 10 within theASIC 5. A single fiber layer 10 (if there is only one fiber layer 10within the ASIC 5) or the plurality of fiber layers 10 thus make up anentire fiber optic network 9 (not shown) within the ASIC 5. A pluralityof local fiber optic controllers 40 (See FIG. 4) act as routers andarbiters between the fiber optic channels 10 and a plurality of cores 50(See FIG. 4) within the ASIC 5. The term core 50 (See e.g., FIG. 4), asused herein, refers to a particular section of logic. The controllers 40are responsible for choosing an optimal fiber optic channel 12 to reachthe destination core 50. The controllers 40 can communicate with asingle core 50, or a plurality of cores 50, as well as a pair of opticaltransmitters 20 and optical receivers 30. The controller 40, along withtheir respective optical transmitter 20 and optical receiver 30 can belocated as needed on the ASIC 5. For example, a desired location for aparticular controller 40 on the ASIC 5 would be where there is a greaterneed for latency-free communication between cores 50.

FIG. 4 shows a conceptual view of a particular portion of an ASIC 5showing the communication via fiber optic lines 12 (e.g., 12A, 12B)between just two cores 50 (e.g., 50A, 50B), presuming that the twoparticular cores 50A, 50B in FIG. 4 need to communicate with each other.A first, or source core, 50A needs to read data from the second, ordestination core 50B. Each core 50A, 50B have affiliated drivers 20, andreceivers 30. For example, drivers 20D, 20E, 20F and receivers 30D, 30Eare affiliated with core 50B. Conversely, drivers 20A, 20B, 20C andreceivers 30A, 30B, 30C are affiliated with core 50A. During a firstclock cycle, the first core 50A will send a read address, control andtransfer qualifier bits to a local fiber optic controller 40A. The fiberoptic controller 40A determines which fiber optic channel (12A or 12B)should be used for transmission to the desired destination core, namelythe second core 50B. In FIG. 4 the controller 40A determines that fiberoptic channel 12A shall be used for transmission. Various reasons that acontroller 40 will select a particular fiber optic channel 12 overanother fiber optic channel 12 include that one channel 12 may bedefective, one channel 12 may have a different (e.g., shorter) lengththan other channels 12, etc. The fiber optic controller 40A then sendthe data to the appropriate transmitter, or driver 20, in this casedriver 20A. The driver 20A, in turn, encodes the data for fiber optictransmission and drives the optical data packet through the fiber opticchannel 12A specified by the controller 40A. The controller's 40Acorresponding optical receiver 30, in this case specifically 30D, thendecodes the returning handshake and lets the controller 40A know thatthe transmission of data was either successful or needs to beretransmitted. This reply back to the controller 40A is done from driver20D back to receiver 30A, via fiber optic channel 12B. If the transferwas successful, the controller 40A sends a type of ACK (i.e.,acknowledgment) signal back to the source core 50A. If, however, thetransmission was unsuccessful, then the controller 40A can take steps toretry the transmission. If there is a collision in the attemptedtransmission, the controller 40A could choose a secondary fiber opticpath 12 (not shown). If an error existed in the data itself or if thereceiving core 50B was busy, the controller 40A could simply retry atransmission again.

Some additional features could be provided with the present invention.An error checking scheme could be included thereby allowing recovery ofthe sent data if there are collisions and/or incorrect transmissions.Additionally, there could be snoopers along the fiber optic network 10which could decode addresses to ensure cache coherency. Also, featuresfrom traditional bus arbitration architecture could be added such ascore abort mechanisms, timeout errors, and retry signals.

FIGS. 6A, 6B, and 6C show top views of a progression of the constructionof an optical medium connection, in accordance with the presentinvention. FIGS. 7A,7B, and 7C show side views of the same correspondingconstructs shown in FIGS. 6A-6C, respectively. In all six figures, on anoxide passivation surface 60 is attached a bump 15. In FIGS. 6B and 7Bis shown a bump 15 which has been etched in half, thereby producing anetched face 16. As FIGS. 6C and 7C show a optical fiber 12 is connectedto the etched face 16 of the bump 15. The light transmitted 200 is thusable to be sent along the optical fiber 12 and upon reaching the etchedbump 15 turns vertically wherein the light 200 is able to be sent toother levels (not shown) and ultimately on to the optical detectorcircuit, specifically the receiver 30.

FIG. 8 shows a broader view of the detailed connection of FIGS. 6C and7C and its relationship to a portion of an ASIC 5. Numerous Damascenewires 320 are connected to traditional (i.e., metal) vias 310 amongstthe plurality of oxide passivation surfaces 60. As the present inventionprovides, and FIG. 8 indicates, light 200 transmitting along a fiber 12from a transmitter 12 (not shown) through a bump 15 and on toreceiver(s) 30. In so doing, however, the transmitted light 200 is ableto readily avoid the various constructs such as the wires 320 and vias310.

There is a need in the present invention for redirecting the transmittedlight 200. One example of a location where this redirection occurs iswhen transmitted light 200 is required to leave a particularly glasslayer, or plane 10. Another example of this is when transmitted light200 must turn, or be redirected, onto a particular, required glass layer10. Thus, a redirection termination 17 acts much like a reflector ofsorts. There are numerous shapes for redirection terminations 17,several depicted in FIGS. 10A, 10B, and 10C. The redirectionterminations 17 which is made from a reflective material, such as metal,and is configured so as to produce, or allow, a reflection of thetransmitted light 200 signal either onto or off of a light level 10. Theredirection terminations 17 can be curved, or hemispherical (FIG. 9A),slanted (FIG. 9B), V or cone-shaped (FIG. 9C), or another suitable shapefor redirecting the light signal 200. The various redirectiontermination 17 configurations also offer an advantage of minimizing thetransmit strength required for the light source.

FIG. 10 similarly shows a sectional side view of a portion of an ASIC 5employing aspects of the present invention. The portion of the ASIC 5shown has a plurality of metal layers 300A, 300B, 300C and a fiber opticnetwork 9 comprised of a plurality of glass layers 10A, 10B, 10Cinterspersed amongst the metal layers 300A, 300B, 300C. A particularsection of logic (i.e., core 50) (See e.g., FIG. 4) would contain anoptical transmitter 20 (See e.g., FIG. 4) that can transmit light 200within a particular glass layer 10A. Suppose a signal, in the form oftransmitted light 200 is required to be sent from the transmitter 20 atthe first glass layer 10A to a receiver 30 (See e.g., FIG. 4) on thethird glass layer 10C. In order to redirect the transmitted light 200from the first glass layer 10A to the third glass layer 10C a means mustbe created that allows the transmitted light 200 to be redirected, orreflected, out of the first glass layer 10A, then in the direction ofthe third glass layer 10C, and then onto the third glass layer 10C wherethe desired receiver 30 resides. Thus, a light path 18, with the use ofa redirection termination(s) 17, provides the requisite redirectioningof light. This light path, although functionally similar to a metal via,is constructed from a material that allows for the transmission of lightthrough it. Because this light path, or light via 18, can be constructedof the same material as the glass layers 10A, 10B, 10C, an addedadvantage of the invention is that the thermal contraction and expansionconstants between the various glass layers 10A, 10B, 10C and the lightvia(s) 18 would be the same which prevents thermal stresses that wouldotherwise result from differential coefficient of thermal expansionunder temperature-varying conditions.

Thus, as FIG. 10 depicts a light signal 200 could originate from atransmitter 20 on the first glass layer 10A. The transmitted light 200would approach a redirection termination 17B (i.e., slant-shaped)causing the light 200 to be reflected out of the first glass layer 10Aand along a light via 18. When the transmitted light 200 reaches thedestination third glass layer 10C, the light 200 reflects off of asecond redirection termination 17A (i.e., hemispherical-shaped). Thetransmitted light 200 then is appropriately transmitted along the thirdglass layer 10C to receiver 30. It should be apparent to one skilled inthe art, that various shaped redirection termination 17A, 17B, 17C (SeeFIGS. 9A, 9B, 9C) can be used, as can a plurality of light vias 18.

Thus, optic transmitters 20 (See e.g., FIG. 4) can direct light signals200 upwards (or downwards) onto a redirection termination, ordispersion, device 17, wherein the redirection device 17 scatters thelight across the optic plane 10. As a result, all receivers 30 (Seee.g., FIG. 4) will be able to detect the transmission. The redirectiondevice 17 can be spherical in shape in order to ensure even dispersal ofthe light. The receiver 30 can also utilize a lens for light gathering.In order to avoid interference from light reflections and to createsignal attenuation, the base of the optic plane(s) 10 can be made, orcoated, with a non-reflective material. Thus, the light-absorbingattribute of the base of the optic plane 10 will reduce the number oftimes a signal reflects around the optic plane 10.

An LED can be used as the optical transmitter 20. The selection of theparticular type of LED used as the transmitter 20 affects the wavelengthof the light signal 200. As a result, an embodiment can have multiplelight signals of differing frequencies propagating simultaneously tomultiple receivers 30 without impeding, or interfering, with each other.This can be done also all within a single oxide layer 10. For example,for each pair of cores 50 that wish to communicate with each other,there could be a separate wavelength of light for that particular pairof cores 50. As a result, the communication between two particular cores50 would not require overhead for decoding or arbitration since thecommunication can flow freely between those two particular cores 50,while other light frequencies are being used by other cores 50.

For purposes of this invention, it should be noted that the frequenciesof “light” that can transmitted through the optical fibers 12 in thepresent invention include electromagnetic waves in both the visualspectrum (i.e., about 3.8×10¹⁴-7.5×10⁴ Hz) and infrared radiation (i.e.,about 10¹¹-3.8×10⁴ Hz). Thus, the term “light”, “light signal”, etc., asused in this disclosure includes both infrared radiation and visiblespectrum electromagnetic radiation.

In FIG. 11 shows an embodiment of an ASIC 5, detailing an edge of thepassivation 65 of the ASIC 5, in accordance with the present invention.The feature shown in FIG. 11 indicates one way that the presentinvention will dump the photons from the various oxide levels 10 oncethe light signals 200 have been transmitted and received (i.e., used).The plurality of oxide levels 10 and metal levels 300 are shown aboveseveral active circuits 7 on the ASIC 5. Thus, the beveled oxide, orglass, edge 65 serves as a type of light “sink”, wherein the lightsignals 200 are absorbed, or “dumped” into the oxide edge 65 and/orultimately off the edge 6 of the chip 5. An oxide edge 65 near the chipedge 6 is beveled at an angle, θ, to fully reflect the light 200 furtherdown into the glass, or oxide edge 65. The angle of reflection, θ, willdiffer depending on the particular index of refraction of the materialused in the oxide edge 65. In essence, this feature prevents therecirculation of light 200 back into the plurality of oxide layers 10and metal layers 300 once the light has been transmitted and receivedappropriately by the transmitters 20 and receivers 30.

Communication Protocol:

FIG. 5 depicts a flow chart for a method for communicating using thepresent invention of transmitting data via a fiber optic medium 12 (Seee.g., FIG. 4). The flow chart 100 starts with a sending step 105,wherein a sending, or source core 50 (See e.g., FIG. 4) sends a requestwith an address and control signals to its respective controller 40 (Seee.g., FIG. 4). In the second step 110, the controller 40 both decodesthe desired destination and determines the best driver, or opticaltransmitter 20 (See e.g., FIG. 4), on which to send the signals. Then instep 115, the driver 20 sends the request, data and address to a opticalreceiver 30 (See e.g., FIG. 4). At the decision step 120, adetermination as to whether the receipt of the transmission sent in step115 is made. If the receipt at the optical receiver 30 is notsuccessful, then step 115 is re-executed. However, if the transmissionto the optical receiver 30 is successful, then step 130 is nextexecuted. In step 130, data is decoded and sent on from the opticalreceiver 30 to destination controller 40. Upon receipt of the decodeddata, the destination controller 40 sends in step 140 an acknowledgment(i.e., “ACK”), or data, depending on the request, back to the source.

The present invention can use a communication protocol that can consistof initiated pulse patterns such that the recipient device (i.e., core50) would recognize its optical i.d., so that all subsequentcommunications would be received by that particular recipient core 50.The communication transmission could be terminated by a pulse gap, forexample. Other communications schemes could be employed that use commonmedia.

This communication protocol could be used from multiple transmitters 20with multiple receivers 30 per glass layer 10 or separated by non-opaqueregions on the same layer 10. The communication can be accomplished byusing the same frequency of light while employing a collision protocol,or by using differing frequencies of light for tuned receivers 30. Seee.g., FIG. 3. Another advantage of the present invention is thatcommunication signals can send data packets with an I.D., controlsegments, and data segments all within the same packet; whereaspreviously data and control segments were sent separately. This resultsin more efficient communication transmission.

While this invention has been described in conjunction with the specificembodiments outlined above, it is evident that many alternatives,modifications and variations will be apparent to those skilled in theart. Accordingly, the embodiments of the invention as set forth aboveare intended to be illustrative, not limiting. Various changes may bemade without departing from the spirit and scope of the invention asdefined in the following claims.

1. An optical transmission method, comprising: performing a plurality ofsignal transmissions between cores of an integrated circuit, whereineach signal transmission is between two cores of a different pair ofcores a plurality of different pairs of cores of the cores of theintegrated circuit, wherein each signal transmission comprises atransmission of an optical signal in the visible or infrared portion ofthe electromagnetic spectrum at a wavelength that is specific to eachdifferent pair of cores and is a different wavelength for each differentpair of cores and there is no overhead for decoding or arbitration insaid preforming the signal transmissions that would otherwise exist if asame wavelength for the optical signals were permitted for pairs ofcores of the different pairs of cores.
 2. The method of claim 1, whereinsaid performing the plurality of signal transmissions comprisesperforming a first signal transmission at a first wavelength in thevisible or infrared portion of the electromagnetic spectrum andperforming a second signal transmission at a second wavelength in thevisible or infrared portion of the electromagnetic spectrum while thefirst signal transmission is being performed such that the secondwavelength differs from the first wavelength.
 3. The method of claim 2,wherein the first wavelength is in the visible portion of theelectromagnetic spectrum, and wherein the second wavelength in thevisible portion of the electromagnetic spectrum.
 4. The method of claim2, wherein the first wavelength is in the visible portion of theelectromagnetic spectrum, and wherein the second wavelength in theinfrared portion of the electromagnetic spectrum.
 5. The method of claim2, wherein the first wavelength is in the infrared portion of theelectromagnetic spectrum, and wherein the second wavelength in thevisible portion of the electromagnetic spectrum.
 6. The method of claim2, wherein the first wavelength is in the infrared portion of theelectromagnetic spectrum, and wherein the second wavelength in theinfrared portion of the electromagnetic spectrum.
 7. The method of claim2, wherein the integrated circuit comprises: multiple layers comprisinga plurality of glass layers and a plurality of metal layers in analternating pattern such that the glass layers and the metal layersalternate in direct mechanical contact with respect to each other, abeveled edge adjacent to the multiple layers and oriented at an anglewith respect to the multiple layers, a lower space below the multiplelayers and below the beveled edge, said lower space bounded by a chipedge of the integrated circuit, the cores, an optic controller connectedto each core, a plurality of optical transmitters connected to each coreunder control of the optic controller of each core such that eachoptical transmitter connected to each core is disposed within a glasslayer of the plurality of glass layers, a plurality of optical receiversconnected to each core under control of the optic controller of eachcore such that each optical receiver connected to each core is disposedwithin a glass layer of the plurality of glass layers, and a pluralityof optical channels, each optical channel comprising optical fibers fortransmission of optical signal and extending from one of the opticaltransmitters connected to one core of the cores to one of the opticalreceivers connected to another core of the cores.
 8. The method of claim7, wherein each signal transmission is between an optical transmitterfrom one core of the cores to which a first optic controller isconnected to an address of an optical receiver of another core of thecores to which a second optical controller is connected, and whereinperforming each signal transmission comprises: decoding, by the firstoptic controller, the address; after said decoding, selecting an opticalchannel of the plurality of optical channels for subsequentlytransmitting an optical signal over the selected optical channel,wherein the selected optical channel extends from the opticaltransmitter of the one core and the optical receiver of the anothercore, and wherein said selecting is performed by the first opticcontroller; after said selecting, transmitting data from the first opticcontroller to the optical transmitter of the one core; encoding intooptical data, by the optical transmitter of the one core, thetransmitted data; and transmitting the optical signal comprising theoptical data from the optical transmitter of the one core to the opticalreceiver of the another core via the selected optical channel.
 9. Themethod of claim 7, wherein said performing the first signal transmissioncomprises transmitting a first optical signal from a first opticaltransmitter attached to a first core of said cores to a first opticalreceiver attached to a second core of said cores over a first opticalchannel of the plurality of optical channels; wherein the first opticaltransmitter is disposed within a first glass layer of the plurality ofglass layers and the first optical receiver is disposed within a secondglass layer of the plurality of glass layers such that the first andsecond glass layers are different glass layers; wherein the firstoptical channel comprises a first segment of the first glass layer, asecond segment of the second glass layer, a first light via disposedbetween the first segment and the second segment, a first redirectiontermination disposed between the first segment and the first light viaand having a shape for causing the first optical signal propagating inthe first segment to be diverted into the first light via to propagatein the first light via, and a second redirection termination disposedbetween the first light via and the second segment and having a shapefor causing the first optical signal exiting from the first light via tobe diverted into the second segment to propagate only in the secondglass layer to the first receiver.
 10. The method of claim 9, whereinthe method further comprises after the first optical signal is receivedby the first optical receiver: directing photons of the first opticalsignal away from the multiple layers and into the beveled edge andtotally reflecting the photons from the beveled edge into the lowerspace and out of the integrated circuit through the chip edge, saidangle being sufficient for said totally reflecting to occur.
 11. Themethod of claim 9, wherein optical fibers of the first glass layer, thesecond glass layer, and the first light via through which the firstoptical signal is transmitted consist of a same glass material.
 12. Themethod of claim 9, wherein a density of the optical fibers in the firstglass layer differs from a density of the optical fibers in the secondglass layer.
 13. The method of claim 9, wherein the first opticalreceiver uses a lens to gather the first optical signal.
 14. The methodof claim 7, wherein said performing the second signal transmissioncomprises transmitting a second optical signal from a second opticaltransmitter attached to a third core of said cores to each opticalreceiver of the plurality of optical receivers connected to a fourthcore of said cores over a second optical channel of the plurality ofoptical channels.
 15. The method of claim 14, wherein the second opticaltransmitter is disposed within a third glass layer of the plurality ofglass layers, and wherein the plurality of optical receivers connectedto the fourth core are disposed within different glass layers of theplurality of glass layers.
 16. The method of claim 15, wherein thesecond optical channel comprises: a third segment of the third glasslayer; a second light via coupled to the third segment and extending toa fourth glass layer of the plurality of glass layers, wherein the thirdand fourth glass layers are different glass layers; a third redirectiontermination disposed between the third segment and the second light viaand having a shape for causing the second optical signal propagating inthe third segment to be diverted into the second light via to propagatein the second light via; and a fourth redirection termination disposedbetween the second light via and the fourth segment and having aspherical shape for causing the second optical signal exiting from thesecond light via to be dispersed so as to be detected by each opticalreceiver of the plurality of optical receivers connected to the fourthcore.
 17. The method of claim 7, wherein the plurality of glass layerscomprises a first glass layer having optical fibers oriented in a firstdirection and a second glass layer having optical fibers oriented in asecond direction, and wherein the second direction differs from thefirst direction.
 18. The method of claim 17, wherein the plurality ofglass layers further comprises a third glass layer having optical fibersoriented in a third direction, wherein the second glass layer isdisposed between the first glass layer and the third glass layer, andwherein the third direction differs from the second direction.
 19. Themethod of claim 18, wherein the third direction does not differ from thefirst direction.
 20. The method of claim 19, wherein the plurality ofglass layers further comprises a fourth glass layer having opticalfibers oriented in a fourth direction, wherein the third glass layer isdisposed between the second glass layer and the fourth glass layer,wherein the fourth direction differs from the third direction, andwherein the fourth direction does not differ from the second direction.